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The UV photolithography system transfers patterns onto semiconductor wafers using ultraviolet light. A patterned mask exposes photoresist to define microscopic structures. This process is fundamental to microelectronics fabrication.

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• RRID
• 7 months ago - submitted by Texas State CRO

The Tergeo plasma cleaner removes organic contaminants from sample surfaces using plasma. This improves sample cleanliness and imaging quality. It is commonly used before microscopy or surface analysis experiments.

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• 7 months ago - submitted by Texas State CRO

The critical point dryer removes liquids from delicate samples without causing structural damage. It replaces liquid with gas at a critical point where surface tension disappears. This technique is commonly used in electron microscopy sample preparation.

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• 7 months ago - submitted by Texas State CRO

The hydraulic pellet press compresses powdered materials into solid pellets using high pressure. These pellets can then be analyzed using spectroscopic techniques. The instrument is widely used in materials and chemical analysis laboratories.

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• 7 months ago - submitted by Texas State CRO

The wire saw cuts fragile or hard materials using a thin moving wire and abrasive slurry. This method produces very precise cuts with minimal mechanical stress. It is frequently used for slicing semiconductor wafers and crystal samples.

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• 7 months ago - submitted by Texas State CRO

The precision saw cuts samples with high accuracy while minimizing material damage. It is used to prepare wafers, ceramics, and other hard materials for further analysis. The instrument is essential for sample preparation in research laboratories.

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• 7 months ago - submitted by Texas State CRO

The Mastersizer 3000+ measures particle size distribution using laser diffraction. It analyzes how particles scatter light to determine their size range. This instrument is commonly used in materials science and pharmaceutical research.

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• 7 months ago - submitted by Texas State CRO

The cryostat maintains extremely low temperatures for cutting frozen biological or materials samples. It allows researchers to prepare thin sections while preserving sample integrity. Cryostats are commonly used in pathology and biological research.

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• 7 months ago - submitted by Texas State CRO

The cryo-ultramicrotome cuts ultra-thin sections of samples at very low temperatures. Cooling the specimen preserves delicate structures and prevents deformation. This technique is often used for electron microscopy sample preparation.

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• 7 months ago - submitted by Texas State CRO

The Leica RM2125 rotary microtome slices extremely thin sections of materials or biological samples. These sections are prepared for microscopic analysis. The instrument is widely used in histology and materials sample preparation.

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• 7 months ago - submitted by Texas State CRO

The Filmetrics F-20 measures thin film thickness using optical reflectance spectroscopy. By analyzing reflected light from a film surface, the system calculates thickness and optical properties. It is widely used in semiconductor and coating research.

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• 7 months ago - submitted by Texas State CRO

The DektakXT surface profilometer measures step heights and surface roughness on materials. A fine stylus scans across the sample surface to record topographical variations. It is commonly used to measure thin film thickness and etch depth.

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• 7 months ago - submitted by Texas State CRO

The Olympus FV3000 is a laser scanning confocal microscope used for high-resolution imaging of fluorescent samples. It captures optical sections of samples to produce detailed three-dimensional images. This system is widely used in biological and materials imaging research.

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• 7 months ago - submitted by Texas State CRO

The Talos F200i Transmission Electron Microscope provides atomic-scale imaging of materials. Electrons transmitted through ultra-thin samples reveal crystal structures, defects, and nanoscale features. This tool is essential for nanotechnology and advanced materials characterization.

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• RRID
• 7 months ago - submitted by Texas State CRO

The wafer bonder joins two semiconductor wafers together using pressure, heat, or adhesives. This technique is commonly used in MEMS fabrication and advanced semiconductor packaging. Wafer bonding allows the integration of multiple materials into a single device structure.

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• RRID
• 7 months ago - submitted by Texas State CRO

The P-Type diffusion furnace is used to introduce acceptor dopants into semiconductor substrates. This process creates p-type regions needed for transistor and diode structures. The furnace provides precise temperature control for consistent dopant diffusion.

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• 7 months ago - submitted by Texas State CRO

The N-Type diffusion furnace introduces donor impurities into semiconductor materials to create n-type regions. High temperatures allow dopant atoms to diffuse into silicon wafers. This process is a fundamental step in semiconductor device fabrication.

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• 7 months ago - submitted by Texas State CRO

The Rapid Thermal Annealer heats samples to high temperatures for very short time periods. This allows researchers to activate dopants or repair crystal damage without affecting the entire wafer structure. It is frequently used in semiconductor processing and materials research.

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• RRID
• 7 months ago - submitted by Texas State CRO

The Oxford PlasmaPro ICP/RIE system performs dry etching of materials using plasma chemistry. It combines inductively coupled plasma with reactive ion etching to provide precise control of etch rates and profiles. This tool is widely used in semiconductor pattern transfer and nanofabrication processes.

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• RRID
• 7 months ago - submitted by Texas State CRO

The Plasma-Enhanced Chemical Vapor Deposition system deposits thin films using plasma to activate chemical reactions in precursor gases. This process enables lower temperature deposition while maintaining high film quality. PECVD is commonly used to deposit dielectric materials such as silicon nitride and silicon dioxide.

• Resource
• RRID
• 7 months ago - submitted by Texas State CRO