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NIEHS funded biomedical knowledgebase to provide a curated collection of geospatial datasets and associated information. It enables, data discoverability, data harmonization and data re-uses of GeoSpatial datasets in the USA. GeoSpace has three core modules.
Centralized, annotated repository for the Osteoarthritis Initiative (OAI) study, designed to accelerate research by organizing and linking extensive clinical, imaging (MRI/X-ray), and biomarker data. It aims to help researchers analyze knee osteoarthritis prevention, treatment, and progression.
Bioinformatics knowledge base and datacenter focusing on skeletal phenotypes. Provides searchable bone phenotyping data for knockout mouse lines, interactive histomorphometry plots, and raw data, supporting research into skeletal genetics, disease mechanisms, and personalized skeletal health treatments.
Web application to search data on BRCA1/2 genetic variants and corresponding clinical data from around the world. Used to search for BRCA1 or BRCA2 variants.
Software tool to find combinations of objects within categories. Can be utilized in bioinformatic analyses to transform two-mode target-pathway relationships to one-mode target-target relationships to generate combination of target genes within related pathways.
The UV photolithography system transfers patterns onto semiconductor wafers using ultraviolet light. A patterned mask exposes photoresist to define microscopic structures. This process is fundamental to microelectronics fabrication.
The Tergeo plasma cleaner removes organic contaminants from sample surfaces using plasma. This improves sample cleanliness and imaging quality. It is commonly used before microscopy or surface analysis experiments.
The critical point dryer removes liquids from delicate samples without causing structural damage. It replaces liquid with gas at a critical point where surface tension disappears. This technique is commonly used in electron microscopy sample preparation.
The hydraulic pellet press compresses powdered materials into solid pellets using high pressure. These pellets can then be analyzed using spectroscopic techniques. The instrument is widely used in materials and chemical analysis laboratories.
The wire saw cuts fragile or hard materials using a thin moving wire and abrasive slurry. This method produces very precise cuts with minimal mechanical stress. It is frequently used for slicing semiconductor wafers and crystal samples.
The precision saw cuts samples with high accuracy while minimizing material damage. It is used to prepare wafers, ceramics, and other hard materials for further analysis. The instrument is essential for sample preparation in research laboratories.
The Mastersizer 3000+ measures particle size distribution using laser diffraction. It analyzes how particles scatter light to determine their size range. This instrument is commonly used in materials science and pharmaceutical research.
The cryostat maintains extremely low temperatures for cutting frozen biological or materials samples. It allows researchers to prepare thin sections while preserving sample integrity. Cryostats are commonly used in pathology and biological research.
The cryo-ultramicrotome cuts ultra-thin sections of samples at very low temperatures. Cooling the specimen preserves delicate structures and prevents deformation. This technique is often used for electron microscopy sample preparation.
The Leica RM2125 rotary microtome slices extremely thin sections of materials or biological samples. These sections are prepared for microscopic analysis. The instrument is widely used in histology and materials sample preparation.
The Filmetrics F-20 measures thin film thickness using optical reflectance spectroscopy. By analyzing reflected light from a film surface, the system calculates thickness and optical properties. It is widely used in semiconductor and coating research.
The DektakXT surface profilometer measures step heights and surface roughness on materials. A fine stylus scans across the sample surface to record topographical variations. It is commonly used to measure thin film thickness and etch depth.
The Olympus FV3000 is a laser scanning confocal microscope used for high-resolution imaging of fluorescent samples. It captures optical sections of samples to produce detailed three-dimensional images. This system is widely used in biological and materials imaging research.
The Talos F200i Transmission Electron Microscope provides atomic-scale imaging of materials. Electrons transmitted through ultra-thin samples reveal crystal structures, defects, and nanoscale features. This tool is essential for nanotechnology and advanced materials characterization.
The wafer bonder joins two semiconductor wafers together using pressure, heat, or adhesives. This technique is commonly used in MEMS fabrication and advanced semiconductor packaging. Wafer bonding allows the integration of multiple materials into a single device structure.