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A microfabricated, 3D-sharpened silicon shuttle for insertion of flexible electrode arrays through dura mater into brain.

Hannah R Joo | Jiang Lan Fan | Supin Chen | Jeanine A Pebbles | Hexin Liang | Jason E Chung | Allison M Yorita | Angela C Tooker | Vanessa M Tolosa | Charlotte Geaghan-Breiner | Demetris K Roumis | Daniel F Liu | Razi Haque | Loren M Frank
Journal of neural engineering | 2019

Electrode arrays for chronic implantation in the brain are a critical technology in both neuroscience and medicine. Recently, flexible, thin-film polymer electrode arrays have shown promise in facilitating stable, single-unit recordings spanning months in rats. While array flexibility enhances integration with neural tissue, it also requires removal of the dura mater, the tough membrane surrounding the brain, and temporary bracing to penetrate the brain parenchyma. Durotomy increases brain swelling, vascular damage, and surgical time. Insertion using a bracing shuttle results in additional vascular damage and brain compression, which increase with device diameter; while a higher-diameter shuttle will have a higher critical load and more likely penetrate dura, it will damage more brain parenchyma and vasculature. One way to penetrate the intact dura and limit tissue compression without increasing shuttle diameter is to reduce the force required for insertion by sharpening the shuttle tip.

Pubmed ID: 31216526

Research resources used in this publication

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Associated grants

  • Agency: NIMH NIH HHS, United States
    Id: F30 MH115582
  • Agency: NINDS NIH HHS, United States
    Id: U01 NS090537
  • Agency: NINDS NIH HHS, United States
    Id: UF1 NS107667

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