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Desktop scanning electron microscope with increased chamber size for large samples up to 100 mm x 100 mm.
Desktop scanning electron microscope that provides high-quality images and features autofocus and automated source alignments.
Desktop scanning electron microscope that offers fast, high-resolution imaging in addition to an integrated energy-dispersive X-ray diffraction (EDS) detector for elemental analysis.
Electrical failure analysis system for semiconductors that uses high sensitivity broadband DBX photon emission and Static Laser Stimulation techniques to pinpoint the location of electrical faults.
Desktop scanning electron microscope that is used to scan sample and find suspect gunshot residue particles. If suspect particle is found, Energy Dispersive Spectroscopy technique is used to identify elements in that particle.
Focused ion beam system that for semiconductors that enables a highly controlled beam profile and current, accurate navigation and ion beam placement, and reliable end-pointing.
Electrical failure analysis system for semiconductors with fault localization and transistor characterization that allows users to characterize individual transistor performance down to 7nm node.
Transmission electron microscope that provides fast, precise measurements for semiconductor manufacturers to develop and control their wafer fabrication processes.
Electrical failure analysis system for low-voltage, high-density semiconductor devices with the ability to diagnose wide ranging failure modes, including parametric failures and those resulting from design-process marginalities.
Semiconductor with enhanced lock in thermal emission that provides better signal to noise ratio, increased sensitivity and higher feature resolution than steady state thermography.
Electrical failure analysis system for semiconductors that enables faster defect localization by using production testers, load boards, and probe cards.
Electrical failure analysis system for semiconductors with optimized dynamic LSM platform that supports automated test equipment docking and back side analysis with laser voltage probing, laser voltage imaging, and laser simulation for critical path analysis.
Electrical failure analysis system for semiconductors that provides visible laser voltage imaging and probing and dynamic laser stimulation on sub-10nm devices.
Transmission electron microscope that is used for automated applications such as single particle analysis, cryo-electron tomography, and micro electron diffraction.
Wafer analysis system that can create site-specific transmission electron microscope (TEM) samples thin enough to capture a single transistor at the 10nm node, from wafers up to 300mm in diameter.
Electrical failure analysis system for semiconductors that offers transistor probing for electrical characterization and fault localization in support of semiconductor technology development, yield engineering and device reliability improvement.
LX-60 Specimen Radiography System is best for imaging larger animals and more dense specimens, due to its cabinet size and energy range of up to 60 kV. The system's large 12 cm x 12 cm camera offers 10 lp/mm spatial resolution. Magnification allows for spatial resolution of up to 60 lp/mm. The 10-12 �m typical focal spot and up to 6X additional geometric magnification provide ultra high-contrast and high spatial resolution images. If a larger field of view is required, the LX-60 can be used with a CR plate and small, upright CR reader to obtain a field of view up to 10� x 12� (25.4 cm x 30.5 cm).
Microscope that features 200 kV XFEG optics and ensures a robust and contamination-free pathway throughout the entire workflow, from sample preparation and optimization to image acquisition and data processing.
Sample preparation workflow that is used for transmission electron microscopy (TEM) analysis.
Nanoprobing platform that provides electrical characterization and fault isolation capabilities for process development, device design debug, and failure analysis.