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PlasmaPro 80 is compact, small footprint system offering etch and deposition solutions with open loading. Open load design allows fast wafer loading and unloading, ideal for research, prototyping and low volume production. It enables high performance processes using optimised electrode cooling and substrate temperature control.
PlasmaPro 800 offers solution for Plasma Enhanced Chemical Vapour Deposition processes on large wafer batches and 300mm wafers, in compact footprint, open loading system. Large wafer platen allows for production scale batch processing and 300mm wafer handling.
PlasmaPro 80 is compact, small footprint system offering etch and deposition solutions with open loading. Open load design allows fast wafer loading and unloading, ideal for research, prototyping and low volume production. It enables high performance processes using optimised electrode cooling and substrate temperature control.
PlasmaPro 80 ICP is compact, small footprint system offering ICP etch solutions with open loading. Open load design allows fast wafer loading and unloading, ideal for research, prototyping and low volume production. It enables high performance processes using optimised electrode cooling and substrate temperature control.
PlasmaPro 100 RIE modules deliver anisotropic dry etching. Being compatible with all wafer sizes up to 200mm, it has rapid change between wafer size, uniformity, high throughput and high precision processes, in situ chamber cleaning and end pointing, and wide temperature range electrode, from 150 degrees C to 400 degrees C.
ICPCVD process module is designed to produce films at low growth temperatures, enabled through high density remote plasmas that achieves film quality with low substrate damage.
PECVD process modules are designed to produce uniformity and high rate films, with control of film properties such as refractive index, stress, electrical characteristics and wet chemical etch rate.
Platform is designed to give total flexibility for Deep Silicon Etch applications. Serves diverse set of process requirements across Micro Electro Mechanical Systems and Advanced Packaging and Nanotechnology markets.
PlasmaPro 100 ALE delivers precise process control to create and manipulate thinner layers through specialised hardware including precise control of gas dose, repeatability of low power RF delivery, and switching enabled by fast PLC.
PlasmaPro 100 Cobra ICP utilises high density plasma to achieve etching and deposition rates. Process modules offer uniformity, high throughput, high precision and low damage processes for wafer sizes up to 200mm.
Ninth generation of nanomanipulator, OmniProbe 400 uses piezo actuation for nanoscale positioning. Nanomanipulator with high resolution and high throughput applications.
Features Asylum Research performance and quality and offers high resolution imaging, supports large samples, most imaging modes, and many accessories.
Measurement system used for quantum transport measurements. In conjunction with cryogenic research tools, it offers multi channel measurements to for quantum technologies.
Features same core performance as MFP 3D Origin but includes support for complete range of innovative MFP 3D accessories.
Integrates AFM and optical microscopy for bioscience research. Bio AFM that uses AFM imaging resolution, force measurement performance, and application versatility while integrating optical techniques.
Asylum Research MFP-3D family of AFM's extend beyond basic topography measurements with diverse set of available accessories designed to enhance capabilities of the AFM. These include accessories for making nano-electric measurements, for example conductivity and piezoelectric response, measurements under magnetic fields, measuring nanomechanical properties, and controlling the temperature and humidity.
PlasmaPro 800 offers a flexible solution for Plasma Enhanced Chemical Vapour Deposition (PECVD) processes on large wafer batches and 300mm wafers, in a compact footprint, open-loading system. The large wafer platen allows for production scale batch processing and 300mm wafer handling.
Cryogenic environment controller that includes single channel 24 bit high resolution temperature measurement circuit, which supports all standard cryogenic sensors, like ruthenium oxide, cernox, silicon diodes, platinum, thermocouple and RhFe. With constant voltage mode, it enables accurate temperature measurement using negative temperature sensors down to below 250 mK.
Ion beam deposition products produce deposited films with high quality, dense and smooth surfaces. Ion beam technology provides approach to etch and deposition by offering single tool and maximising system utilisation, which includes open load, single substrate load lock, and cassette to cassette.
Magnet power supply system enables automated control of wide range of superconducting magnets, including NMR, high field, beamline and Vector Rotate magnet systems. MercuryiPS is bi polar and has high stability, four quadrant power supply with incorporated quench protection.