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Symmetry uses customised CMOS sensor to unlock combination of speed, sensitivity and diffraction pattern detail.
Ultra high resolution FEG SEM application and delivers solutions beyond micro and nano analysis. It uses radical geometry for both imaging and EDS performance in ultra high resolution FEG SEMs while working at low kV and short working distance, with EDS resolution that approaches that of SEM.
Maximised large area etching and deposition production solutions available in load lock or cluster configurations with up to 3 chambers and vacuum load lock as standard with cluster capability options.
TritonXL is used for research applications where sample temperatures below 5 mK is required, for integrating larger numbers of signal lines or very high magnetic fields. Has two integrated 1.5 W pulse tube coolers, decoupled with flexible braids and bellows to minimize vibrations.
Integrated Cryofree® superconducting magnet system with variable temperature inserts. Has standard magnetic fields up to 14 T in compact geometry, integrated variable temperature insert providing sample temperatures between 1.5 K and 300 K, and range of high performance sample rods with height adjustment and rotation options.
Chemical Vapour Deposition and PECVD tools for growth of 1D and 2D nanomaterials and heterostructures. PlasmaPro 100 Nano delivers performance growth of nanomaterials with in situ catalyst activation and process control, with flexible temperatures up to 1,200 degrees C.
Self supporting Secondary Insert that enhances adaptability, enabling rapid exchange of full experimental setups for multi user, multi experiment system. Upgradeable Secondary Inserts are cross compatible and transferrable between ProteoxTM family systems. Has large experimental volume and abundant line of sight access.
Split pair, horizontal field magneto optical Cryofree superconducting magnet system. It provides optical access to sample in variable magnetic field and low temperature environment.
PlasmaPro 80 reactive ion etch is compact, small footprint system offering etch and deposition solutions with open loading. Open load design allows fast wafer loading and unloading, ideal for research, prototyping and low volume production. It enables high performance processes using optimised electrode cooling and substrate temperature control.
PlasmaPro 80 is compact, small footprint system offering etch and deposition solutions with open loading. Open load design allows fast wafer loading and unloading, ideal for research, prototyping and low volume production. It enables high performance processes using optimised electrode cooling and substrate temperature control.
PlasmaPro 800 offers solution for Plasma Enhanced Chemical Vapour Deposition processes on large wafer batches and 300mm wafers, in compact footprint, open loading system. Large wafer platen allows for production scale batch processing and 300mm wafer handling.
PlasmaPro 80 is compact, small footprint system offering etch and deposition solutions with open loading. Open load design allows fast wafer loading and unloading, ideal for research, prototyping and low volume production. It enables high performance processes using optimised electrode cooling and substrate temperature control.
PlasmaPro 80 ICP is compact, small footprint system offering ICP etch solutions with open loading. Open load design allows fast wafer loading and unloading, ideal for research, prototyping and low volume production. It enables high performance processes using optimised electrode cooling and substrate temperature control.
PlasmaPro 100 RIE modules deliver anisotropic dry etching. Being compatible with all wafer sizes up to 200mm, it has rapid change between wafer size, uniformity, high throughput and high precision processes, in situ chamber cleaning and end pointing, and wide temperature range electrode, from 150 degrees C to 400 degrees C.
ICPCVD process module is designed to produce films at low growth temperatures, enabled through high density remote plasmas that achieves film quality with low substrate damage.
PECVD process modules are designed to produce uniformity and high rate films, with control of film properties such as refractive index, stress, electrical characteristics and wet chemical etch rate.
Platform is designed to give total flexibility for Deep Silicon Etch applications. Serves diverse set of process requirements across Micro Electro Mechanical Systems and Advanced Packaging and Nanotechnology markets.
PlasmaPro 100 ALE delivers precise process control to create and manipulate thinner layers through specialised hardware including precise control of gas dose, repeatability of low power RF delivery, and switching enabled by fast PLC.
PlasmaPro 100 Cobra ICP utilises high density plasma to achieve etching and deposition rates. Process modules offer uniformity, high throughput, high precision and low damage processes for wafer sizes up to 200mm.
Ninth generation of nanomanipulator, OmniProbe 400 uses piezo actuation for nanoscale positioning. Nanomanipulator with high resolution and high throughput applications.