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URL: https://sro.txst.edu/sro-facilities/sro-nrsc/sro-nrsc-wb.html
Proper Citation: Texas State University Wafer Bonder system (RRID:SCR_028207)
Description: Facility EVG 501 wafer bonder system applies pressure up to 10kN and temperature up to 450C to samples with prepared surfaces (specific chemical surface termination). When the system mechanically brings these surfaces into contact the temperature and pressure sequence activates chemical bonds at the interfaces that fuse the sample surfaces together. A precision wafer bonding system used to join semiconductor wafers using thermal, adhesive, or anodic bonding techniques for device integration.
Synonyms: Wafer Bonder (EVG520)
Resource Type: instrument resource
Keywords: wafer bonding, MEMS, semiconductor integration, microfabrication
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